XenCureTM
Reactive Q–T polysiloxanes for crosslinking, fast curing, wetting and strong adhesion on metals/minerals.
Technology Overview XenCure and XenSlick Product Guide XenRes Product GuideXenCureTM
PERFORMANCE BENEFITS
The XenCureTM product family is designed to offer improved adhesion and curing characteristics in organic resins and polymer systems. Specifically, XenCureTM products excel in the following aspects:
- Fast cure speed
- High crosslinking ability
- Improved wetting and adhesion on metal and mineral substrates
- Compatibilization between polymer resin and inorganic substrate or filler matrix
- Boosting mechanical properties and durability of product formulations
APPLICATIONS
We particularly recommend XenCureTM as:
- Crosslinker, adhesion promoter and toughness modifier in adhesives & sealants
- Coupling agent and crosslinker in rubber and elastomer compounds
- Binder and reactive diluent in mineral filled moisture curing formulations
- Surface modifier for fillers and sizing / finish ingredient in fiber & textiles
- Processing aid and reactive crosslinker in (reactive) polymer processing
- Additive for thermoplastics processing and in hot melt adhesives
PRODUCT RANGE
XenCureTM products and their corresponding functionalities include:
- XenCureTM A primary amino
- XenCureTM A1/A2/A9 secondary amino
- XenCureTM 2A aminoethyl-amino
- XenCureTM S mercapto
- XenCureTM V vinyl
- XenCureTM G glycidoxy / modified glycidoxy
- XenCureTM U methacryloxy
Siloxene Product Overview
XenCureTM
Reactive Q-T polysiloxanes for crosslinking, fast curing, wetting and strong adhesion on metals/minerals.
XenSlickTM
Hydrophobic Q-T polysiloxanes for improved slip/gloss/friction control, hydrophobization & emulsifying.
XenLinkTM
Amphiphilic Q–T polysiloxanes featuring one reactive and one hydrophobic group for balanced interface tuning.
XenBluTM
VOC-free and surfactant-free. Available as resin concentrates or aqueous dispersions.
XenResTM
Hybrid co-resins with Epoxy, STP, Acrylate or Isocyanate resins for improved performance.